Component manufacturing for telecom industry:

BOI approves Lanmark Engineering project

Chairman / Managing Director BoI Dhammika Perera presenting the Certificate of Registration to the investors

The Board of Investment of Sri Lanka granted investment approval to Lanmak Engineering (Private) Limited to manufacture components for the telecommunication industry. Chairman/Director General Dhammika Perera signed the agreement on behalf of the BOI and presented the BOI Certificate of Registration to the investors.

The investment agreement worth Rs. 110 million was signed with Lanmak Engineering, to manufacture metal components and parts for telecommunication equipment and towers. These components would be supplied to local telecommunication providers such as Dialog, Mobitel, Airtel and Sri Lanka Telecom. Lanmak Engineering would be manufacturing components such as bolts, nuts, tower fittings, auxiliary items, cross arms and D brackets for the local market.

The venture will set up a state-of-the-art manufacturing plant at Seeduwa and will be utilising machinery imported mainly from India. Imported raw material will be used for production of the metal components. The venture is expected to generate employment for 200.

Chairman/Managing Director Sarath Samarakoon, and Director Srimal Amaraweera signed the agreement on behalf of Lanmak Engineering.